Synthesis and characterization of Sn-Cu/SiO2(np) lead-free nanocomposite solder through angular accumulative extrusion

Synthesis and characterization of Sn-Cu/SiO2(np) lead-free nanocomposite solder through angular accumulative extrusion
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doi
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Date : 1402-04
Article type
Journal
https://people.iut.ac.ir/en/niroumand/content/1601068