Asymmetric Cu Diffusion in Transient Liquid Phase (TLP) Bonding of Inconel 625 to AISI 316L Stainless Steel with Cu Interlayer

Asymmetric Cu Diffusion in Transient Liquid Phase (TLP) Bonding of Inconel 625 to AISI 316L Stainless Steel with Cu Interlayer
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doi
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Date : 1400-11
Article type
Journal
https://people.iut.ac.ir/en/shamanian/content/1603703