Asymmetric Cu Diffusion in Transient Liquid Phase (TLP) Bonding of Inconel 625 to AISI 316L Stainless Steel with Cu Interlayer
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doi
Date : 1400-11
Article type
Journal
Asymmetric Cu Diffusion in Transient Liquid Phase (TLP) Bonding of Inconel 625 to AISI 316L Stainless Steel with Cu Interlayer
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