An Investigation on Microstructure and Mechanical Properties of a Copper Strip Subjected to Different Routes of Accumulative Roll Bonding Process

An Investigation on Microstructure and Mechanical Properties of a Copper Strip Subjected to Different Routes of Accumulative Roll Bonding Process
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doi
10.1007/s11665-022-07145-0
Date : 1401-10
Article type
Journal
https://people.iut.ac.ir/en/toroghinejad/content/1601943