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Resiliency-aware analysis of complex IoT process chains
Data supporting the hierarchically activated deformation mechanisms to form ultra-fine grain microstructure in carbon containing FeMnCoCr twinning induced plasticity high entropy alloy
A new trend of using poly(vinyl alcohol) in 3D and 4D printing technologies: Process and applications
A novel Cu-carbon nanotube sheet composite manufactured via the ARB process: A microstructural and mechanical study
Investigation the effect of processing condition and dispersed phase content on rheology-morphology relationship in polypropylene/polyethylene terephthalate microfibrillar composite
The importance of type of Ti-based additives on the PEO process and properties of Al2O3-TiO2 coating
The importance of type of Ti-based additives on the PEO process and properties of Al2O3-TiO2 coating
Three-decade assessment of dry and wet spells change across Iran, a fingerprint of climate change
A three-stage engineered deposition rate profile in evaporation processes for ultra-thin metallic transparent conductors
Microstructure-electrochemical behavior relationship in post processed AISI316L stainless steel parts fabricated by laser powder bed fusion
Microstructure-electrochemical behavior relationship in post processed AISI316L stainless steel parts fabricated by laser powder bed fusion
A high-dimensional control chart for monitoring process variability under gauge imprecision effect
An Investigation on Microstructure and Mechanical Properties of a Copper Strip Subjected to Different Routes of Accumulative Roll Bonding Process
An Investigation on Microstructure and Mechanical Properties of a Copper Strip Subjected to Different Routes of Accumulative Roll Bonding Process
Selenium nanoparticles reduce Ce accumulation in grains and ameliorate yield attributes in mung bean (Vigna radiata) exposed to CeO2