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Manufacturing and characterization of Sn-Cu/SiO2np lead-free nanocomposite solder by accumulative roll bonding (ARB) process
Manufacturing and characterization of Sn-Cu/SiO2np lead-free nanocomposite solder by accumulative roll bonding (ARB) process
Accelerated Gaussian quantum state transfer between two remote mechanical resonators
Electronic and interfacial properties of graphene/HfS<sub>2</sub> van der Waals heterostructure
Characterization of Fluidic-Barrier-Based Particle Generation in Centrifugal Microfluidics
Physicochemical and sensory properties of malt beverage containing sugar beet saponins
Physicochemical and sensory properties of malt beverage containing sugar beet saponins
Microstructure and Corrosion Properties of Electrodeposited CoCrFeMnNi High Entropy Alloy Coatings
Microstructure and Corrosion Properties of Electrodeposited CoCrFeMnNi High Entropy Alloy Coatings
Structural, dielectric, magnetic and magnetoelectric properties of the PFN-PT/Co1-xNixFe2O4 multiferroic composites
Effects of ER308L buttering and post-buttering heat treatment on the microstructure and mechanical properties of API 5L X65/AISI304 dissimilar joint
Effects of ER308L buttering and post-buttering heat treatment on the microstructure and mechanical properties of API 5L X65/AISI304 dissimilar joint
Theoretical study of the mechanism of Te (g)?+3F<sub>2</sub> (g)?TeF<sub>6</sub> (g)
Theoretical study of the mechanism of Te (g)?+3F<sub>2</sub> (g)?TeF<sub>6</sub> (g)
Theoretical study of the mechanism of Te (g)?+3F<sub>2</sub> (g)?TeF<sub>6</sub> (g)