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Application of chiral diacid N-trimellitylimido-L-valine for the surface modification of copper oxide as inorganic filler and preparation of poly(amide–imide)/cupric oxide nanocomposites
Application of chiral diacid N-trimellitylimido-L-valine for the surface modification of copper oxide as inorganic filler and preparation of poly(amide–imide)/cupric oxide nanocomposites
Journal of Membrane science
Safe and fast polyamidation of 5-[4-(2-phthalimidiyl-propanoylamino)benzoylamino]-isophthalic acid with aromatic diamines in ionic liquid under microwave irradiation
S. Najafi
Biography 49
Research Experience
A. Sivandian
Forough Sohrabizadeh
محمد رضا دهنوی-Mohammad Reza Dehnavi
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