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Effects of high voltage electric field on storage life and antioxidant capacity of whole pomegranate fruit
Theoretical and experimental study of calcium extraction using ionic liquids: COSMO-RS approach
A novel nanohybrid based on metal-organic framework MIL101-PANI/Ag for the adsorption of cationic methylene blue dye from aqueous solution
A novel nanohybrid based on metal-organic framework MIL101-PANI/Ag for the adsorption of cationic methylene blue dye from aqueous solution
Elastic response of Carbon Black reinforced polyester based composites using micromechanical models: Role of interphase
Optimization of Water Distribution Networks Using a New Entropy-based Mixed Reliability Index and a Fuzzy-based Constraint Handling Technique
The singular and combined effects of drought and copper stresses on the morphological traits, photosynthetic pigments, essential oils yield and copper concentration of Fumaria parviflora Lam.
The singular and combined effects of drought and copper stresses on the morphological traits, photosynthetic pigments, essential oils yield and copper concentration of Fumaria parviflora Lam.
Sustainable Conjunctive Water Use Modeling Using Dual Fitness Particle Swarm Optimization Algorithm
Quantification of some intrinsic soil properties using proximal sensing in arid lands: application of Vis-NIR, MIR, and pXRF Spectroscopy
Preparation of chromium and sulfur single and co-doped TiO2 nanostructures for efficient photoelectrochemical water splitting: effect of aliphatic alcohols on their activity
Preparation of chromium and sulfur single and co-doped TiO2 nanostructures for efficient photoelectrochemical water splitting: effect of aliphatic alcohols on their activity
Digital analysis of egg surface area and volume: Effects of longitudinal axis, maximum breadth and weight
Effects of a tiny particle trapped in a spherical cavity on fluid structure, contact density, and capillary condensation (a DFT approach)
The Effect of Bonding Time on Dissimilar Joint Properties Between Inconel 625 and AISI 316L Using Transient Liquid Phase Bonding Method with Cu Interlayer