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Dr. Behzad Niroumand
Professor, Department of Materials Engineering
en
Manufacturing and characterization of Sn-Cu/SiO2np lead-free nanocomposite solder by accumulative roll bonding (ARB) process
Date : 1401-02-15
doi
10.1007/s10854-022-08286-7
Article type
Journal
Dr. Behzad Niroumand
https://people.iut.ac.ir/en/content/102817
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