Microstructure and mechanical properties of transient liquid phase bonding of Al2O3/Al nanocomposite using copper interlayer
-
doi
Date : 1392-10
Article type
Journal
Microstructure and mechanical properties of transient liquid phase bonding of Al2O3/Al nanocomposite using copper interlayer
×
https://people.iut.ac.ir/en/salimijazi/content/1623616?view=qrcode