An Investigation on Microstructure and Mechanical Properties of a Copper Strip Subjected to Different Routes of Accumulative Roll Bonding Process

An Investigation on Microstructure and Mechanical Properties of a Copper Strip Subjected to Different Routes of Accumulative Roll Bonding Process
-

doi
10.1007/s11665-022-07145-0
Article type
Journal
https://people.iut.ac.ir/en/rezaeian/content/1601944