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MaxEnt brings comparable results when the input data are being completed; Model parameterization of four species distribution models
Soil quality indicators along a degradation gradient in central Iran: comparison of two regions with contrasting grazing systems
Soil quality indicators along a degradation gradient in central Iran: comparison of two regions with contrasting grazing systems
Soil quality indicators along a degradation gradient in central Iran: comparison of two regions with contrasting grazing systems
Soil quality indicators along a degradation gradient in central Iran: comparison of two regions with contrasting grazing systems
Systems Biology-Derived Genetic Signatures of Mastitis in Dairy Cattle: A New Avenue for Drug Repurposing
Systems Biology-Derived Genetic Signatures of Mastitis in Dairy Cattle: A New Avenue for Drug Repurposing
Monitoring, Source Identification and Environmental Risk of Potentially Toxic Elements of Dust in Isfahan Province, Central Iran
Monitoring, Source Identification and Environmental Risk of Potentially Toxic Elements of Dust in Isfahan Province, Central Iran
Monitoring, Source Identification and Environmental Risk of Potentially Toxic Elements of Dust in Isfahan Province, Central Iran
Implementation of time-weighted residual method for simulation of flexural waves in multi-span Timoshenko beams subjected to various types of external loads: from stationary loads to accelerating moving masses
Implementation of time-weighted residual method for simulation of flexural waves in multi-span Timoshenko beams subjected to various types of external loads: from stationary loads to accelerating moving masses
Parametric study of a fluidic oscillator for heat transfer enhancement of a hot plate impinged by a sweeping jet
The Effect of Bonding Time on Dissimilar Joint Properties Between Inconel 625 and AISI 316L Using Transient Liquid Phase Bonding Method with Cu Interlayer
The Effect of Bonding Time on Dissimilar Joint Properties Between Inconel 625 and AISI 316L Using Transient Liquid Phase Bonding Method with Cu Interlayer