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An efficient time-space formulation for dynamic transient analyses: application to the beam assemblies subjected to moving loads and masses
Evaluation of mechanical and durability properties of engineered cementitious composites exposed to sulfate attack and freeze-thaw cycle
Optimization of growth performance responses of Japanese quail with different concentrations of metabolizable energy, lysine, and sulfur amino acids using Taguchi method
Optimization of growth performance responses of Japanese quail with different concentrations of metabolizable energy, lysine, and sulfur amino acids using Taguchi method
Investigation on mechanical properties of nanofoam aluminum single crystal: using the method of molecular dynamics simulation
Investigation on mechanical properties of nanofoam aluminum single crystal: using the method of molecular dynamics simulation
Mehdi Habibi. Maryam Fanaei. Zarrindokht Emami, A double gate DNA FET based on solution processed ZnO nano layers for high sensitivity and low cost oligonucleotide hybridization detection, Microelectronic Engineering
Evaluation of microstructure and mechanical properties of Al/Al2O3/SiC hybrid composite fabricated by accumulative roll bonding process
Evaluation of microstructure and mechanical properties of Al/Al2O3/SiC hybrid composite fabricated by accumulative roll bonding process
The solution of direct and inverse transient heat conduction problems with layered materials using exponential basis functions
The solution of direct and inverse transient heat conduction problems with layered materials using exponential basis functions
Nonlocal vibration and buckling analysis of single and multi-layered graphene sheets using finite strip method including vander Waals effects
Nonlocal vibration and buckling analysis of single and multi-layered graphene sheets using finite strip method including vander Waals effects
Growth photosynthesis and ion balance of sesame (Sesamum indicum L.) genotypes in response to NaCl concentration in hydroponic solutions
On effect of squeezing pressure on microstructural characteristics heat treatment response and electrical conductivity of an Al-Si-Mg-Ni-Cu alloy