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Development of a dual sideway-share subsurface tillage implement: Part 1. Modeling tool interaction with soil using DEM
Analysis of bilinear hysteretic structures with nonlinear fluid viscous dampers using modified stochastic linearization technique
Design of a pDNA nanocarrier with ascorbic acid modified chitosan coated on superparamagnetic iron oxide nanoparticles for gene delivery
Design of a pDNA nanocarrier with ascorbic acid modified chitosan coated on superparamagnetic iron oxide nanoparticles for gene delivery
Design of a pDNA nanocarrier with ascorbic acid modified chitosan coated on superparamagnetic iron oxide nanoparticles for gene delivery
Theoretical and experimental study of calcium extraction using ionic liquids: COSMO-RS approach
Elastic response of Carbon Black reinforced polyester based composites using micromechanical models: Role of interphase
Optimization of Water Distribution Networks Using a New Entropy-based Mixed Reliability Index and a Fuzzy-based Constraint Handling Technique
Implementation of time-weighted residual method for simulation of flexural waves in multi-span Timoshenko beams subjected to various types of external loads: from stationary loads to accelerating moving masses
Implementation of time-weighted residual method for simulation of flexural waves in multi-span Timoshenko beams subjected to various types of external loads: from stationary loads to accelerating moving masses
Sustainable Conjunctive Water Use Modeling Using Dual Fitness Particle Swarm Optimization Algorithm
Quantification of some intrinsic soil properties using proximal sensing in arid lands: application of Vis-NIR, MIR, and pXRF Spectroscopy
A game-theoretic approach to designing an optimal code of conduct program to promote supplier sustainability in a supply chain
The Effect of Bonding Time on Dissimilar Joint Properties Between Inconel 625 and AISI 316L Using Transient Liquid Phase Bonding Method with Cu Interlayer
The Effect of Bonding Time on Dissimilar Joint Properties Between Inconel 625 and AISI 316L Using Transient Liquid Phase Bonding Method with Cu Interlayer