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Enhancing Wear Behavior and Hardness of D5 Cold Work Tool Steel through TiCrN Multilayer Nanocoating via Physical Vapor Deposition
Enhancing Wear Behavior and Hardness of D5 Cold Work Tool Steel through TiCrN Multilayer Nanocoating via Physical Vapor Deposition
Enhancing Wear Behavior and Hardness of D5 Cold Work Tool Steel through TiCrN Multilayer Nanocoating via Physical Vapor Deposition
A new algorithm for computing staggered linear bases
Nanoencapsulation of oregano essential oil using cellulose nanocrystals extracted from hazelnut shell to enhance shelf life of fruits: Case study: Pears
Self-healing interpenetrating network hydrogel based on GelMA/alginate/nano-clay,
Nanostructured multilayer CAE-PVD coatings based on transition metal nitrides on Ti6Al4V alloy for biomedical applications
Nanostructured multilayer CAE-PVD coatings based on transition metal nitrides on Ti6Al4V alloy for biomedical applications
Synthesis of Fe<sub>3</sub>O<sub>4</sub>/ZrO<sub>2</sub>/CuO magnetic nanohybrids and their applications in reducing chromium(<scp>vi</scp>) and degrading methylene blue under sunlight
Synthesis of Fe<sub>3</sub>O<sub>4</sub>/ZrO<sub>2</sub>/CuO magnetic nanohybrids and their applications in reducing chromium(<scp>vi</scp>) and degrading methylene blue under sunlight
Development of lanthanide-based 'all in one' theranostic nanoplatforms for TME-reinforced T1-weighted MRI/CT bimodal imaging
Evaluation of yellow mealworm larvae (Tenebrio molitor, Insecta, Tenebrionidae) meal as a dietary protein source in Asian Seabass (Lates calcarifer) based on growth and some biochemical parameters
Evaluation of yellow mealworm larvae (Tenebrio molitor, Insecta, Tenebrionidae) meal as a dietary protein source in Asian Seabass (Lates calcarifer) based on growth and some biochemical parameters
Evaluation of yellow mealworm larvae (Tenebrio molitor, Insecta, Tenebrionidae) meal as a dietary protein source in Asian Seabass (Lates calcarifer) based on growth and some biochemical parameters
Synthesis and characterization of Sn-Cu/SiO2(np) lead-free nanocomposite solder through angular accumulative extrusion