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Application of chiral diacid N-trimellitylimido-L-valine for the surface modification of copper oxide as inorganic filler and preparation of poly(amide–imide)/cupric oxide nanocomposites
Application of chiral diacid N-trimellitylimido-L-valine for the surface modification of copper oxide as inorganic filler and preparation of poly(amide–imide)/cupric oxide nanocomposites
Mahsa Fooladgar

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