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10th International Seminar of Polymer Science and Technology (ISPST 2012)
May 2011
Application of chiral diacid N-trimellitylimido-L-valine for the surface modification of copper oxide as inorganic filler and preparation of poly(amide–imide)/cupric oxide nanocomposites
Application of chiral diacid N-trimellitylimido-L-valine for the surface modification of copper oxide as inorganic filler and preparation of poly(amide–imide)/cupric oxide nanocomposites