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Torsional behavior of non-crimp orthogonal woven composite using experimental and numerical methods
Investigation on the Mechanical Properties and Microstructure of Eco-friendly Mortar Containing WGP at Elevated Temperature
Decrypting the photocatalytic bacterial inactivation of hierarchical flower-like Bi2WO6 microspheres induced by surface properties: Experimental studies and ab initio calculations
Decrypting the photocatalytic bacterial inactivation of hierarchical flower-like Bi2WO6 microspheres induced by surface properties: Experimental studies and ab initio calculations
Decrypting the photocatalytic bacterial inactivation of hierarchical flower-like Bi2WO6 microspheres induced by surface properties: Experimental studies and ab initio calculations
Tracking Defense Mechanisms in an EFL Setting: Pseudo-altruism on Top
Tracking Defense Mechanisms in an EFL Setting: Pseudo-altruism on Top
Implementation of time-weighted residual method for simulation of flexural waves in multi-span Timoshenko beams subjected to various types of external loads: from stationary loads to accelerating moving masses
Implementation of time-weighted residual method for simulation of flexural waves in multi-span Timoshenko beams subjected to various types of external loads: from stationary loads to accelerating moving masses
Evaluation the Properties of Polycaprolactone /Fluorapatite Nano-biocomposite
Anti-cancer properties and catalytic oxidation of sulfides based on vanadium(V) complexes of unprotected sugar-based Schiff-base ligands
Quantification of some intrinsic soil properties using proximal sensing in arid lands: application of Vis-NIR, MIR, and pXRF Spectroscopy
An Enhanced Grey Wolf Optimizer with a Velocity-Aided Global Search Mechanism
The Effect of Bonding Time on Dissimilar Joint Properties Between Inconel 625 and AISI 316L Using Transient Liquid Phase Bonding Method with Cu Interlayer
The Effect of Bonding Time on Dissimilar Joint Properties Between Inconel 625 and AISI 316L Using Transient Liquid Phase Bonding Method with Cu Interlayer