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Formulation, characterization, and physical stability of encapsulated walnut green husk (Juglans regia L.) extract in phosphatidylcholine liposomes L.) extract in phosphatidylcholine liposomes
Formulation, characterization, and physical stability of encapsulated walnut green husk (Juglans regia L.) extract in phosphatidylcholine liposomes L.) extract in phosphatidylcholine liposomes
Formulation, characterization, and physical stability of encapsulated walnut green husk (Juglans regia L.) extract in phosphatidylcholine liposomes L.) extract in phosphatidylcholine liposomes
Instrumental shade sorting of colored fabrics using genetic algorithm and particle swarm optimization
Exploring the antibacterial potential of magnetite/Quince seed mucilage/Ag nanocomposite: Synthesis, characterization, and activity assessment
Exploring the antibacterial potential of magnetite/Quince seed mucilage/Ag nanocomposite: Synthesis, characterization, and activity assessment
Influence of mechanochemically fabricated nano-hardystonite reinforcement in polycaprolactone scaffold for potential use in bone tissue engineering: Synthesis and characterization
Influence of mechanochemically fabricated nano-hardystonite reinforcement in polycaprolactone scaffold for potential use in bone tissue engineering: Synthesis and characterization
Characterization of 14 Triticum species for the NAM-B1 gene and its associated traits
Characterization of 14 Triticum species for the NAM-B1 gene and its associated traits
An antibacterial Multi-layered scaffold fabricated by 3D printing and electrospining methodologies for skin tissue regeneration
An antibacterial Multi-layered scaffold fabricated by 3D printing and electrospining methodologies for skin tissue regeneration
Corrosion protection of superhydrophobic/amphiphobic cobalt coating with anti-icing and self-cleaning properties fabricated by a one-step electrodeposition method
Synthesis and characterization of Sn-Cu/SiO2(np) lead-free nanocomposite solder through angular accumulative extrusion
Synthesis and characterization of Sn-Cu/SiO2(np) lead-free nanocomposite solder through angular accumulative extrusion