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The effects of oxide film and annealing treatment on the bond strength of Al Cu strips in cold roll bonding process
Application of some antifungal and antioxidant compounds from some herbs to be used in cake as biopreservatives
Application of some antifungal and antioxidant compounds from some herbs to be used in cake as biopreservatives
The solution of direct and inverse transient heat conduction problems with layered materials using exponential basis functions
The solution of direct and inverse transient heat conduction problems with layered materials using exponential basis functions
On effect of squeezing pressure on microstructural characteristics heat treatment response and electrical conductivity of an Al-Si-Mg-Ni-Cu alloy
On effect of squeezing pressure on microstructural characteristics heat treatment response and electrical conductivity of an Al-Si-Mg-Ni-Cu alloy
Influence of MA-g-HDPE compatibilizer content on quality and adhesion/bending strength of polyethylene/O-MMT coating films
Influence of MA-g-HDPE compatibilizer content on quality and adhesion/bending strength of polyethylene/O-MMT coating films
Microstructural characterization and electrical conductivity of CuxMn3-xO4 (0.9rxr1.3) spinels produced by optimized glycine nitrate combustion and mechanical milling processes
Microstructural characterization and electrical conductivity of CuxMn3-xO4 (0.9rxr1.3) spinels produced by optimized glycine nitrate combustion and mechanical milling processes
Preparation characterization and application of silica-supported palladium complex as a new and heterogeneous catalyst for Suzuki and Sonogashira reactions
Accuracy of real-time ultrasonography in Assessing Carcas Traits in Torki-ghashghaii Sheep
Modification of Mg/Al-layered double hydroxide with L-aspartic acid containing dicarboxylic acid and its application in the enhancement of the thermal stability of chiral poly(amide-imide
Modification of Mg/Al-layered double hydroxide with L-aspartic acid containing dicarboxylic acid and its application in the enhancement of the thermal stability of chiral poly(amide-imide