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Synthesis and Characterization of a New Cu (BHB)2/Fe-MIL-101-NH2 Composite: A Novel Hydrogen Peroxide Sensor based upon the Bimetallic Complex
The effect of bonding time on the microstructure and mechanical properties of dissimilar transient liquid phase bonding between UNS N08825 alloy and UNS S32750 super duplex stainless steel using the BNi-2 interlayer
The effect of bonding time on the microstructure and mechanical properties of dissimilar transient liquid phase bonding between UNS N08825 alloy and UNS S32750 super duplex stainless steel using the BNi-2 interlayer
Facile Synthesis of Ag Nanowire/TiO2 and Ag Nanowire/TiO2/GO Nanocomposites for Photocatalytic Degradation of Rhodamine B
Formation of a potassium coordination polymer based on a novel 2-sulfono-benzene-1,3,5-tricarboxylic acid: Synthesis, characterization, and application of the organocatalyst in CO2 cycloaddition reaction
Band structure engineering in gallium sulfide nanostructures
Band structure engineering in gallium sulfide nanostructures
Photocatalytic oxidation of benzyl alcohol and the photoelectrochemical water splitting of visible light-activated TiO2 nanostructures prepared by one-step titanium anodization
Photocatalytic oxidation of benzyl alcohol and the photoelectrochemical water splitting of visible light-activated TiO2 nanostructures prepared by one-step titanium anodization
Photocatalytic oxidation of benzyl alcohol and the photoelectrochemical water splitting of visible light-activated TiO2 nanostructures prepared by one-step titanium anodization
Preparation of COOH-KCC-1/polyamide 6 composite by in situ ring-opening polymerization: synthesis, characterization, and Cd(II) adsorption study
Hydroxyapatite mineralization of chitosan-tragacanth blend/ZnO/Ag nanocomposite films with enhanced antibacterial activity
Polycaprolactone/ZnO-folic acid nanocomposite films: Fabrication, characterization, in-vitro bioactivity, and antibacterial assessment
Microstructure and Mechanical Properties of Spark Plasma Sintered Amorphous AlPO4 Ceramics
Geometrical optimization of boron arsenide inserts embedded in a heat spreader to improve its cooling performance for three dimensional integrated circuits