Application of chiral diacid N-trimellitylimido-l-valine for the surface modification of copper oxide as inorganic filler and preparation of poly (amide imide)/cupric oxide nanocomposites

Application of chiral diacid N-trimellitylimido-l-valine for the surface modification of copper oxide as inorganic filler and preparation of poly (amide imide)/cupric oxide nanocomposites
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doi
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Article type
Journal
https://people.iut.ac.ir/en/mallakpour/content/1618050