The use of poly(amide-imide)/CuO as a filler for the preparation of poly(vinyl pyrrolidone) nanocomposites Thermal and morphological studies

The use of poly(amide-imide)/CuO as a filler for the preparation of poly(vinyl pyrrolidone) nanocomposites Thermal and morphological studies
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doi
Article type
Journal
https://people.iut.ac.ir/en/mallakpour/content/1617511